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september 2010 doc id 17741 rev 1 1/11 11 sm6ty automotive 600 w transil? features peak pulse power: ? 600 w (10/1000 s) ? 4 kw (8/20 s) stand-off voltage range: from 6.4 v to 58 v unidirectional and bidirectional types low leakage current: ? 0.2 a at 25 c ? 1 a at 85 c operating t j max : 150 c high power capability at t j max : ? 515 w (10/1000 s) jedec registered package outline resin meets ul 94, v0 ecopack ? 2 compliant components aec-q101 qualified complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) iso 10605, c = 330 pf, r = 330 : ? 15 kv (air discharge) ? 8 kv (contact discharge) iso 7637-2 (for pulse 1 and 2a, applicable only to parts with stand-off voltage (v rm ) lower than the average battery voltage: 13.5 v): ? pulse 1: v s = -100 v ? pulse 2a: v s = +50 v ? pulse 3a: v s = -150 v ? pulse 3b: v s = +100 v description the sm6ty transil series has been designed to protect sensitive automotive circuits against surges defined in iso 7637-2 and against electrostatic discharges according to iec 61000-4-2 and iso 10605. the planar technology makes this device compatible with high-end circuits where low leakage current and high junction temperature are required to provide reli ability and stability over time. sm6ty are packaged in smb (smb footprint in accordance with ipc 7531 standard). tm : transil is a trademark of stmicroelectronics k a unidirectional bidirectional smb (jedec do-214aa) www.st.com
characteristics sm6ty 2/11 doc id 17741 rev 1 1 characteristics figure 1. electrical characteristics - definitions figure 2. pulse definition for electrical characteristics table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iso 10605 (c = 330 pf, r = 330 ) contact discharge air discharge iec 61000-4-2 contact discharge air discharge 30 30 30 30 kv p pp peak pulse power dissipation (1) t j initial = t amb 600 w t j operating junction temperature range -55 to 150 t stg storage temperature range -65 to 150 c t l maximum lead temperature for soldering during 10 s. 260 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. table 2. thermal resistance symbol parameter value unit r th(j-l) junction to leads 20 c/w r th(j-a) junction to ambient on printed circuit on recommended pad layout 100 c/w v cl v br v rm i rm i r i pp v i i rm i r i pp v rm v br v cl v cl v br v rm i rm i r i pp v i i rm i r i pp v rm v br v cl v cl v br v rm i rm i r i pp v i i f v f v cl v br v rm i rm i r i pp v i i f v f unidirectional bidirectional symbol parameter v stand-off voltage v breakdown voltage v clamping voltage i leakage current @ v i peak pulse current t voltage temperature coefficient v forward voltage drop r dynamic resistance rm br cl rm rm pp f d repetitive pulse current t r = rise time (s) t p = pulse duration time (s) t r t p
sm6ty characteristics doc id 17741 rev 1 3/11 table 3. electrical characteristics, typical values unless otherwise stated (t amb = 25 c) order code i rm max@v rm v br @i r (1) v cl @i pp 10/1000 s r d (2) 10/1000 s v cl @i pp 8/20 s r d (2) 8/20 s t 25 c 85 c min. typ. max. max. max. a v v ma v (3) a (4) v (3) a (4) 10-4/ c sm6t7v5ay 20 50 6.4 7.13 7.5 10 11.3 53 0.065 14.5 276 0.024 6.1 sm6t18ay/cay 0.2 1 15.3 17.1 18 1 25.2 24 0.263 32.5 123 0.111 8.8 sm6t22ay/cay 0.2 1 18.8 20.9 22 1 30.6 20 0.375 39.3 102 0.159 9.2 sm6t24ay/cay 0.2 1 20.5 22.8 24 1 33.2 18 0.444 42.8 93 0.189 9.4 sm6t27ay/cay 0.2 1 23.1 25.7 27 1 37.5 16 0.569 48.3 83 0.240 9.6 sm6t30ay/cay 0.2 1 25.6 28.5 30 1 41.5 14.5 0.690 53.5 75 0.293 9.7 sm6t33ay/cay 0.2 1 28.2 31.4 33 1 45.7 13.1 0.840 59.0 68 0.357 9.8 sm6t36ay/cay 0.2 1 30.8 34.2 36 1 49.9 12 1.01 64.3 62 0.427 9.9 sm6t39ay/cay 0.2 1 33.3 37.1 39 1 53.9 11.1 1.16 69.7 57 0.504 10.0 sm6t42cay 0.2 1 36 40 42.1 1 58.1 10.3 1.35 76 52 0.611 10.0 sm6t47ay/cay 0.2 1 40 44.4 46.7 1 64.5 9.7 1.59 84 48 0.728 10.1 sm6t68ay/cay 0.2 1 58.1 64.6 68 1 92 6.5 3.17 121 33 1.503 10.4 1. pulse test : t p < 50 ms 2. to calculate maximum clamping voltage at another surge level, use the following formula: v clmax = v cl - r d x (i pp - i ppappli ) where i ppappli is the surge current in the application. 3. to calculate v br or v cl versus junction temperature, use the following formulas: v br @ t j = v br @ 25c x (1 + t x (t j - 25)) v cl @ t j = v cl @ 25c x (1 + t x (t j - 25)) 4. surge capability given for both directions for unidirectional and bidirectional types. figure 3. peak power dissipation versus initial junction temperature (typical values) figure 4. peak pulse power versus exponential pulse duration 0 100 200 300 400 500 600 700 10/1000 s 0 25 50 75 100 125 150 175 p pp (w) t j (c) 0.1 1.0 10.0 100.0 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 p pp (kw) t j initial = 25 c t p (ms)
characteristics sm6ty 4/11 doc id 17741 rev 1 figure 5. clamping voltage versus peak pulse current exponential waveform (maximum values) figure 6. iso 7637-2 pulse 1 response (v s = -100 v) 0.1 1.0 10.0 100.0 10 100 1000 10/1000 s 8/20 s 10 ms t = 25 c j initial i (a) pp v (v) cl sm6t30a sm6t68a sm6t36ay sm6t36cay voltage (v) current (a) time (ms) 0.0 1.0 2.0 3.0 4.0 0 -10 -20 -30 -40 -50 0 -2 -4 -6 -8 -10 -12 10
sm6ty characteristics doc id 17741 rev 1 5/11 figure 7. iso 7637-2 pulse 2a response (v s = 50 v) figure 8. iso 7637-2 pulse 3a response (v s = -150 v) sm6t36ay sm6t36cay voltage (v) current (a) time (s) 0 2030 405060708090100 0 10 30 20 40 50 0 2 4 6 8 10 12 note: curves superimposed sm6t36ay sm6t36cay voltage (v) current (a) time (s) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 20 -20 -40 -50 -30 -10 10 0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 0.5
characteristics sm6ty 6/11 doc id 17741 rev 1 figure 9. iso 7637-2 pulse 3b response (v s = 100 v) note: iso7637-2 pulses responses are not applicab le for products with a stand off voltage lower than the average battery voltage (13.5 v). 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 sm6t36ay sm6t36cay voltage (v) current (a) time (s) note: curves superimposed 10 20 30 40 50 60 0 0 0.5 1.0 1.5 2.0 2.5 3.0 figure 10. junction capacitance versus reverse applied voltage for unidirectional types (typical values) figure 11. junction capacitance versus reverse applied voltage for bidirectional types (typical values) 10 100 1000 1 10 100 sm6t30ay sm6t68ay f = 1 mhz v = 30 mv t = 25 c osc rms j c(pf) v (v) r 1 10 100 c(pf) 10 100 1000 f=1 mhz v osc =30 mv rms t j =25 c sm6t30cay sm6t68cay v (v) r
sm6ty characteristics doc id 17741 rev 1 7/11 figure 12. relative variation of thermal impedance, junction to ambient, versus pulse duration figure 13. thermal resistance junction to ambient versus copper surface under each lead zth (j-a)/rth (j-a) 0.01 0.10 1.00 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 1.0e+0 3 recommended pad layout printed circuit board fr4, copper thickness = 35 m ms t p r th(j-a) (c/w) 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 printed circuit board fr4, copper thickness = 35 m s cu (cm2) figure 14. leakage current versus junction temperature (typical values) figure 15. peak forward voltage drop versus peak forward current (typical values) i r (na) 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 25 50 75 100 125 150 v r =v rm v rm 10 v v r =v rm v rm < 10 v t ( c) j 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.5 1.0 1.5 2.0 2.5 3.0 i fm (a) t j =25 c t j =125 c v fm (v)
application and design guidelines sm6ty 8/11 doc id 17741 rev 1 2 application and design guidelines more information is available in the st application note an2689 ?protection of automotive electronics from electrical hazards, guidelines for design and component selection?. 3 ordering information scheme figure 16. ordering information scheme sm 6 t xx ca y surface mount peak pulse power breakdown voltage types automotive grade 6 = 600 w transil in smb 30 = 30 v ca = bidirectional a = unidirectional
sm6ty packaging information doc id 17741 rev 1 9/11 4 packaging information case: jedec do-214aa molded plastic over planar junction terminals: solder plated, solderable as per mil-std-750, method 2026 polarity: for unidirectional types the band indicates cathode flammability: epoxy meets ul 94, v0 rohs package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 4. smb dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 figure 17. smb footprint dimensions in mm (inches) figure 18. marking layout (1) 1. marking layout can vary according to assembly location. e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62 (0.064) (0.102) (0.300) (0.064) (0.086) y w w z x x x ecopack compliance xxx: marking z: manufacturing location y: year ww: week cathode bar (unidirectional devices only )
ordering information sm6ty 10/11 doc id 17741 rev 1 5 ordering information 6 revision history table 5. marking order code marking order code marking sm6t7v5ay dgy sm6t18ay eey sm6t18cay mey sm6t22ay eky sm6t22cay mky sm6t24ay emy sm6t24cay mmy sm6t27ay epy sm6t27cay mpy sm6t30ay ery sm6t30cay mry sm6t33ay ety sm6t33cay mty sm6t36ay evy sm6t36cay mvy sm6t39ay exy sm6t39cay mxy sm6t42cay nay sm6t47ay fay sm6t47cay nby sm6t68ay fqy sm6t68cay nqy table 6. ordering information order code marking package weight base qty delivery mode sm6txxxay/cay (1) 1. where xxx is nominal value of v br and a or ca indicates unidirectional or bidirectional version. see table 3 for list of available devices and their order codes see table 5 on page 10 smb 0.11 g 2500 tape and reel table 7. document revision history date revision changes 15-sep-2010 1 initial release.
sm6ty doc id 17741 rev 1 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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